Meiya Optoelectronics: bare crystal engine technology

【文| 颜重光王珏越何刚】 Integrated package form of LED optoelectronic integrated engine, using wafer form packaging technology, reasonable optical and thermal design, coupled with high-efficiency and high-quality high-voltage linear constant current technology, to achieve optimal optimization A new generation of optoelectronic integrated LED modules with a combination of cost and performance.

This product design technology can bring an innovative idea to the LED packaging industry, and expand the traditional LED packaging industry up and down. In the current LED packaging industry, the marginal cost increase and the marginal revenue decline are in the current situation, and the cost profit has reached the critical point. Under the situation that the return on investment is not as good as expected, a new photoelectric engine can be obtained without further investment to increase the added value of the product. In line with the trend of integration of semiconductor products and the trend of large-scale production. The bare crystal light engine is designed to produce a new generation of LED bulbs, downlights, etc. It is very convenient and fast. Figure 1 shows the new LED bulbs produced by Ningbo Meiya bare crystal light engine.

Figure 2 New LED bulbs produced by Ningbo Meiya bare crystal light engine

First, the market prospect of bare crystal light engine LED packaging companies can divide downstream users into four categories (Figure 1), we are a LED packaging company in Ningbo, facing the III users, they need good quality and cheap Photoelectric united goods, LED light source and lighting manufacturers are also our largest consumer groups. The bare crystal photoelectric engine can greatly reduce the material and processing cost of the light source and the lamp on the basis of ensuring the superior photoelectric performance of the lamp. It is an ideal choice for the market with the terminal light source and the lamp factory.

Figure 2 LED packaging companies can divide downstream users into four categories

Second, the light engine die <br> <br> optical properties: a high luminous efficiency of up 130lm / w, ≧ 80 color rendering index, color tolerance ≦ 6, in line with EU ERP

Regulations;

Electricity: input AC180-240V/100-130V/50-60HZ, power 5-12W, PF≥0.95,

THD<15%, power efficiency ≥90%, EMC meets CE and RCM certification requirements;

Heat: The thermal conductivity of the substrate is ≥25 W/m. K;

Environmental protection: in line with ROSH standards;

Use: The power AC input lead is directly soldered to the L/N pad on the module to illuminate.

The conduction test of Ningbo Meiya Optoelectronics' bare crystal light engine is shown in Figure 3. The performance meets the needs of large-scale production of LED light sources and lamps. The 10W bare crystal light engine test report (without cover) is shown in Figure 4.



Figure 3: bare crystal light engine conduction test

Figure 4 10W bare crystal light engine test report (without cover)

Third, the composition of the light engine die <br> <br> die by the light engine: a ceramic substrate + + driving power source composed of the COB;

(A) a ceramic PCB, a ceramic PCB substrate <br> <br> substrate shown in FIG. 5, the ceramic substrate is an aluminum substrate has many advantages that are not. The main advantages of ceramic substrates:

1. Compared with the traditional aluminum substrate, the reflectivity of the ceramic substrate is higher, which helps to improve the light efficiency.

2. Ceramics have high reliability characteristics such as oxidation resistance, acid and alkali resistance, wear resistance and aging resistance.

3. Ceramics are insulators, which help LED lighting products pass various high-voltage tests and safety tests.

4. The thermal expansion and contraction coefficient of ceramics is small. Under high temperature environment, the surface is also relatively flat, which helps to maintain the thermal resistance coefficient between the heat sink and the heat sink.

5. The ceramic substrate has a high thermal conductivity, and the same power design can use a smaller space.

The main technical parameters of the ceramic substrate are shown in Table 1.

Figure 5 ceramic PCB substrate

Table 1 Main technical parameters of ceramic substrate
project specification
product material Compliance with EU RoHS environmental requirements
Main substrate material 96% alumina
BaiDu >85%
Reflectance >95%
Graphic size accuracy ±0.05mm
Graphic offset center range ±0.05mm
Warpage <0.03mm
Substrate surface roughness 0.20-0.75μm
Dash depth 40±3%
Dam height 0.3 to 0.7 mm
Thermal Conductivity 25 W/m. K
Thermal expansion coefficient 6.4 to 6.8 ppm/°C
Dielectric strength >12KV/mm
Volume resistivity >1011Ω.cm (20~300°C)
Mechanical strength 350 to 400 Mpa
Surface metal layer Sintered silver layer thickness >11μm

 
(2) Specially designed COB light source 1) COB based on material and chip layout design, high thermal conductivity and long service life.

The COB light source part directly mounts the LED light-emitting chip on the ceramic substrate with excellent thermal conductivity. The thermal conductivity of the ceramic substrate is 20 times or more of that of the aluminum substrate. The extremely high thermal conductivity can quickly introduce the heat into the heat sink, and the heat of the LED is The rapid derivation greatly reduces the thermal attenuation of the LED light-emitting chip.

The chip layout of the ring arrangement ensures that each chip has its own horizontal heat dissipation channel, and the scientific and reasonable heat dissipation design truly ensures the high life of the COB light source part. Instead of adopting the centralized series-parallel arrangement mode of the LED light-emitting chip of the usual COB, the middle part of the chip is subjected to more heat, causing the COB to become brighter in the middle part of the light source due to the central temperature concentration after the point is fixed for a certain period of time. Dark light black light attenuation phenomenon.

Figure 6 Specially designed COB light source

2) Based on scientific and rational optical layout and new packaging materials, superior luminous efficiency and light shape effect are obtained.

The LED chips are arranged in a double-row annular array, which ensures that the light-emitting channels of each LED chip are more smooth and more unobstructed; the light-emitting surface projected by the LED chip array in a circular layout is softer and the illumination distribution is more uniform. Compared with the equivalent energy COB and point source, the light pollution caused by the point source under the same energy is minimized.

The LED chip is fixed on a high reflectivity ceramic substrate, encapsulated with a high refractive index, low stress silicone resin, and the dam is also packaged with a light transmittance of 80% to minimize light loss, and more fully The light source efficiency is utilized.

3) The LED light source adopting multiple strings and less technology can be driven by a small current, thereby reducing the heat generation of the chip.

The LED light source part is designed to operate in a small current (15-60MA) and high voltage (DC220-256V) mode, which reduces the temperature rise of the LED chip and achieves a perfect match with a low-cost linear constant current driving power supply.

(C) high-voltage constant current drive power <br> <br> using wafer level packaging technology, in an extremely simple circuit structure, to achieve a constant current and high efficiency, and to minimize the power cost. The application circuit of the high-voltage linear constant current driving chip is simple, there is no inductor, transformer and electrolytic capacitor. The principle block diagram of the high-voltage linear constant current driving chip is shown in Fig. 7, and the bare IC is wired as shown in Fig. 8.

Figure 7 Block diagram of the high voltage linear constant current driver chip

Figure 8 Die IC wiring diagram

Main features of high voltage linear constant current driver chip:

1) Linear segmented constant current LED drive;

2) The LED light string can be automatically switched according to the LED voltage drop;

3) High precision LED constant current (+/- 3%);

4) Maximum LED peak current: 60mA;

5) PFC is as high as 0.99; THD is less than 15%;

6) Automatic current reduction delay life at high temperature;

7) LED open circuit, short circuit, over temperature, VDD under voltage protection;

8) The built-in power tube reduces the number of BOMs;

9) Easily pass EMC test; meet CE, SAA, C-TICK, UL ​​standards;

10) Wafer type packaging.

The bare crystal light engine will become a new generation of LED photo-electricity packaging technology. The bare crystal photoelectric engine will subvert the current LED light source and lamp manufacturing technology. Using the bare crystal photoelectric engine will enable the automated production line to be fast, convenient and simple. The production of bulbs and downlights will greatly reduce the labor cost of enterprises, further reduce the cost of products for LED light sources and lamps, so that LED light sources and lamps have a more intimate retail price, which may become a cheap entry into the civilian population. Blue Ocean LED products.

About the Author:

Author 1: Yan Chongguang Retired Senior Engineer Adjunct Professor of Shanghai Institute of Microelectronics, Peking University 2: He Gangning, Deputy General Manager of Bomeiya Optoelectronics Technology Co., Ltd. 3: Chairman of Wang Yiyue Ningbo Bomei Optoelectronics Technology Co., Ltd.

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