Saw Resonator HDR315M-B13 Chip Size Package 2.0*1.6mm with better price can replace of 3*3mm DCC6C and DIP Typ

/ September 29, 2018

Model NO.: HDR315M-B13
HS Code: 854190000
 The strong point  for CSP(chip size package) resonator (HDR315M-B13).
 
1. Adopting the most advanced flip chip technology, flipping the chip on the package after bump bonding , then using the ultrasonic  technology to connect the input and output pin.
This process can greatly reduce the fault rate caused by circuit-short or  circuit-break.
 
2. Chip-size package-- SMD 2.0*1.6mm.
They can meet the needs of miniaturized products.
 
3. Competitive price.  
As real SMD-type resonator ,  their price is only half of similar  SMD3030 or SMD 5035 series , 
They can be used as a low-cost solution for the users, while greatly reduce the labor costs of traditional DIP series.
 
 4. Large manufacturing capacity  and Short Lead Time . 
Our lead time for CSP resonator is only one week, because they are produced by fully automatic equipment.
 
Saw Resonator HDR315M-B13 Chip Size Package 2.0*1.6mm with better price can replace of 3*3mm DCC6C and DIP Typ

Saw Resonator HDR315M-B13 Chip Size Package 2.0*1.6mm with better price can replace of 3*3mm DCC6C and DIP Typ
Saw Resonator HDR315M-B13 Chip Size Package 2.0*1.6mm with better price can replace of 3*3mm DCC6C and DIP Typ
Saw Resonator HDR315M-B13 Chip Size Package 2.0*1.6mm with better price can replace of 3*3mm DCC6C and DIP Typ
Saw Resonator HDR315M-B13 Chip Size Package 2.0*1.6mm with better price can replace of 3*3mm DCC6C and DIP Typ
Saw Resonator HDR315M-B13 Chip Size Package 2.0*1.6mm with better price can replace of 3*3mm DCC6C and DIP Typ


 

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