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Among them, Ju Dingyuan mainly uses heat-dissipating materials for LED backlights, and has recently developed towards lighting. In addition, the passive component iron core factory Yuefeng invested in the upstream sapphire crystal rod, and the quartz component factory crystal technology developed the sapphire substrate.
However, the LED backlight and lighting market has changed too quickly. In 2011, due to the global market sentiment, the LED market was greatly affected. In addition to the different customer requirements, the technical threshold is quite high, so that the passive component industry has long been screaming, but it has been seldom with obvious results, and even now it is still at a loss.
The production capacity and shipment volume of Da Yi and Guangqi are also in the early stage compared with the ceramic substrate manufacturer Tongxin. Da Yi currently has a monthly production capacity of about 200,000 pieces, and the light is 120,000 pieces. The downstream market has not yet been heavy, and the monthly shipments of the two companies are only within 50,000. However, Da Yi has been awarded trial orders by international lighting giants such as Osram and Philips, and has also entered almost all Taiwanese high-power packaging plants.
The industry believes that whether the LED heat sink substrate can make a profit contribution in the second half of the year depends on the take-off speed of the entire LED lighting market. The uncertainty of the euro zone still exists. Although there are still many imaginations in LED lighting, companies are optimistic. With a cautious attitude. 
Taiwan's multiple passive component factories are optimistic about the LED cooling substrate
The LED lighting market is regarded as a major trend in the future. Due to similar technology, many passive component companies in Taiwan such as laminated ceramic capacitors (MLCC) plant He Shentang, chip resistor factory Da Yi, protective component factory Juding, ceramic substrate factory Jiuhao And the film passive components factory, etc., are all developed to develop ceramic heat sink substrates.