Technological innovation and market demand are the two major drivers of LED industry development. Throughout the history of China's LED packaging, it has experienced from the early lead-type LED devices, SMD printed circuit board (PCB) structure, polyphthalamide (PPA), poly(trimethylene terephthalate) PCT) to today's aluminum nitride ceramic structure, high-power integrated chip package (ChipOnBoard, COB), thermosetting epoxy resin (EMC) structure LED devices, various types of flip-chip and other different forms of packaging.
As a leading company in the LED packaging industry, Shenzhen Liyang Optoelectronics Co., Ltd. (hereinafter referred to as "Liyang Shares") has witnessed the transformation and technological innovation of LED light source products since its establishment in 2008. In the field of high-power lamp beads, the development of the company's products has gone through three stages: from the earliest 1-3W Lambertian lamp beads to the SMD2835/SMD3030 patch lamp beads, to the current flip-chip FE30/FE35 series. The chips are getting smaller and smaller, the reliability is getting stronger, and the cost performance is getting higher and higher.
The birth of the FE30/FE35 series is based on the market demand for higher power and higher brightness. At the beginning of product development, the market positioning of FE30/FE35 has been very clear: to replace the traditional 1W imitation lumen products, upgrade the plane EMC3030 products, ceramic substrate 3030/3535 products, replace the similar XPG series products, through the super stability and super High cost performance cut into the market.
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Understand the flip, go into the ocean
Why is the FE30/FE35 a cheap luxury lamp? Before introducing the powerful performance of the FE30/FE35 product, it has to be said that the flip-chip packaging process. Flipchip LED, also known as FlipchipLED, is based on flip-chip LED wafer technology. It uses a solder paste reflow process or a eutectic process to connect the LED chip to the support to achieve gold-free package. It completely eliminates leakage caused by gold wires. , flashing, dead lights and other reliability issues. The flip-chip LED packaging process overturns the traditional LED process, from substrate printing solder paste, to wafer die bonding, to reflow soldering, with higher input costs and stricter process technology. This is mainly reflected in the more precise requirements for solder paste printing, the more stable reflow soldering process requirements, the higher requirements for solid crystal precision, and the need to add professional monitoring equipment. This demanding requirement has made it impossible for a large number of enterprises to access this. Core Technology. This has also led to the current market of flip-chip LED light source products, many flip-chip products due to poor wafer performance, raw material quality, coupled with production processes and production equipment can not meet the requirements, resulting in low prices, poor reliability, Affect the image of flip-chip products in the eyes of customers.
As a pioneer in flip-chip light source, Liyang shares in line with the international first-line brand in the process and equipment of flip-chip manufacturing. In the process of substrate printing solder paste, Liyang has adopted the world's leading 3D automatic printing technology. , eutectic connection, good robustness, strong stability, and in terms of monitoring equipment, Liyang is equipped with an expensive X-RAY cavity rate monitor, which monitors the production of the whole process and greatly improves the quality. In April 2016, Liyang Co., Ltd. became the technical research project undertaker of the “Technology Research and Development of Key Technology for High-Power LED Multi-core Integrated Light Source Module Based on Flip-Chip Technology†by Shenzhen Science and Technology Innovation Committee, and obtained government departments in technology research and development funds and related policies. Strong support.
The powerful performance of the FE30/FE35 series products is mainly reflected in the following aspects.
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Super reliability, zero dead light rate
FE30/FE35 series adopts gold-free wire package and adopts imported EMC bracket. It has the advantages of high luminous efficiency, long life, low thermal resistance, small size, flexible size and easy application. EMC device applications offer a seamless alternative to traditional off-the-shelf SMDLED devices and offer significant advantages. Firstly, the electrode of the SMD device chip is located on the light emitting surface, and the metal lead of the bonding is located above the light emitting surface, which absorbs the light emitted from the chip and reduces the luminous efficacy of the LED. The flip chip electrode used in the EMC device is located at the bottom of the chip, and does not affect the surface light output. The leadless package directly avoids the absorption of light by the metal lead. The surface of the chip is transparent sapphire, and its refractive index is between GaN and the encapsulant, which has better light matching with the encapsulant and higher light extraction efficiency; Secondly, the SMDLED bond wire is prone to problems such as virtual soldering, surge shock, insufficient current resistance, stress cracking caused by thermal mismatch of package rubber, etc. It is one of the weakest links in the reliability of LED devices. The medium-dead light rate of 98% is caused by the break of the gold wire. The gold wire breakage will accelerate the current load of other parallel gold wires during operation, resulting in an increase in the instability of the product and an increase in the dead light rate. This is mainly due to the dressing. The structure of the product determines that the FE30/FE35 series reduces the wire bonding process, increases production efficiency, and eliminates many dependencies that may be caused by bond wires. Sexual problems.
The Liyang FE30/FE35 series has obtained the LM-80 test report and meets the ANSI or ERP spectro color separation standard.
Supports large current input up to 1A
In order to concentrate resources on developing high-power devices, the development idea of ​​Liyang Power Devices is “high-density LED technologyâ€, which is commonly known as high power and small size. The so-called high power means to increase the power and light efficiency as much as possible in the same package size, so that although the cost of a single package does not change much, the system integration cost can be greatly reduced.
The original intention of FE30/FE35 series is to adhere to this concept, support 1A high current input, maximum power 3W, luminous flux up to 400lm, far higher than traditional imitation lumen products and plane EMC3030 series products. At present, the imitation lumen products on the market support a maximum current input of 550ma and a maximum power of 1.5W. The planar EMC3030 supports an input current of up to 350ma and a maximum power of only 1W. This makes the FE30/FE35 series products have higher illumination and better illumination than the flat EMC3030 series or imitation lumens in practical applications.
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Super heat channel, product life is greatly improved
Due to the different solid crystal form, FE30/FE35 is nearly 200 times the hot channel of traditional dressing products. The FE30/FE30 series uses a solder paste solid crystal with a thermal conductivity of 55W/(M*K), while the traditional dressing products are mostly made of insulating glue and have a thermal conductivity of only 0.3W/(M*K). This effectively solves the problem of heat conduction of the light source, makes the product heat channel smoother and greatly improves the service life!
Patented Molding technology, customizable light angle
The FE30/FE35 series adopts a self-innovative structure. After precision optics design, it can accept a single angle of light and a minimum angle of 30 degrees, which greatly meets some special-oriented lighting requirements. It is almost impossible to complete in traditional dressing products. For example, the imitation of Lumen products is only 60 degrees. At the same time, the FE30/FE35 patent Molding design improves the light output rate by 10%-15% compared to the previous generation of planar packaging products. At the same time, due to the increased frontal area, the product heat channel is smoother and easier to secondary light distribution.
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Markets, technologies and costs are mutually reinforcing and mutually influential. Technological advances have spawned new application markets, and cost reductions have spurred the penetration of technology into emerging markets. The rise of emerging markets has placed higher demands on technology and cost. This dependency is no exception to the LED industry. The FE30/FE35 series of foreign shares came into being in this kind of environment. Deeply cultivating technology, making technology and cost to the extreme, helping enterprises to become the king of high-power LED market segments, from the crowded Red Sea market to the vast The innocent blue ocean market is part of the strategic plan for the current phase of the company.
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