Japan's TDK pushes thin ceramic substrates with ESD protection for automotive LEDs

Recently, Japan's TDK Corporation released three new products for automotive use at the Munich Electronics Show. They are a thin circuit board for LEDs with built-in ESD protection, an aluminum electrolytic capacitor with high vibration resistance, and a piezoelectric actuator with tactile feedback.

The thin circuit board for LEDs with built-in ESD protection is made of ceramic material and is called "CeraPad". This is the EPCOS brand of multi-layer substrate products, with LEDs on the substrate, no need to equip ESD components.

In other words, with CeraPad, you can achieve excellent ESD protection performance and miniaturization. This product is suitable for LED systems for automotive headlights and smartphone flash.

The new product has an ESD protection of up to 25kV, which is more than three times that of a standard Zener diode. Another major feature is the ultra-thin. The thickness is 300 μ to 400 μm, and the thermal conductivity is three times or more that of a common substrate.

Two types of standard solder (Sn/Ag/Cu, 260 ° C) reflow process and eutectic bonding (AuSn, 320 ° C) are available upon request.

In addition, CeraPad has a thermal expansion coefficient of 6 ppm/K, which is basically the same as that of LEDs, and hardly forms mechanical stress between the circuit board and the LED due to temperature changes.

CeraPad can be applied to a single LED or to an LED array (matrix) composed of multiple LEDs.

For example, if a single standard LED component is available, it can be packaged in a 1.5mm square and 0.7mm square CSP package. By encapsulating the LED array, each LED can be individually controlled by cascading CeraPad.

Compared to LED arrays that used to be in series with LEDs in the past, LED arrays using CeraPad can produce high degree of freedom of illumination.

The ceramic substrate is a circuit board based on highly efficient heat-dissipating, chemically stable ceramic materials, and is particularly suitable for high-power electronic component packaging applications.

Wang Gang, director of sales of new products of Jingpin, said, "With the rapid development and use of high-power semiconductor components such as LED, LD, IGBT, etc., high-end ceramic circuit boards will have good development prospects."

Xue Xirong, chairman of Kangrong Group, said, “At present, many LED companies have begun to flip, and with the expansion of the flip-chip market, the use of ceramic substrates will increase. Kangrong Group is full of confidence in the ceramic substrate industry, and the future is in quality. And the price will also strive to meet customer needs."

The ceramic substrate is a circuit board based on highly efficient heat-dissipating and chemically stable ceramic materials, which is a good choice for LED packaging companies. Especially in some high-end lighting applications market.

"Ceramic substrate technology is a difficult point to overcome, mainly relying on imports, the proportion in the market is relatively small, so the price is relatively higher. In the future, with the participation of more LED companies, the market share of ceramic substrates will also come. The bigger the price, the lower the price. In 2016, we mainly do flip-chip COB, so the ceramic substrate has also become the key target.” A person in charge of the packaging company told the reporter.

Chen Yinghong, Marketing Manager of Jingke Electronics, believes that the current LED heat sink substrates mainly include metal substrates and ceramic substrates, and the price of ceramic substrates is relatively high at the price.

However, as the price of LED packaging products declines, the corresponding materials such as ceramic substrates and phosphors will inevitably follow the price reduction, but the specific price reduction space needs to be determined according to market reaction.

At present, the overall cost performance of the entire ceramic industry has been high, and ceramic substrates are being gradually adopted by many packaging companies with many advantages.


Capacitive Touch Screen

According to the type of sensor, the Touch Screen is roughly divided into infrared type, resistance type, surface acoustic wave type and capacitive touch screen four kinds. The design of capacitive touch screen is reasonable, but the problem of image distortion is difficult to be solved.


Capacitive touch screen


The touch screen works by using the body's current induction process. A special transparent metal conductive substance is coated on the surface of the glass. When a conductive object touches the glass, it changes the capacitance of the contact, so as to detect the position of the touch. But touching a non-conductive object with a gloved hand or hand does not respond because of the addition of a more insulating medium.


Capacitive touch screen can sense light and fast touch, anti-scratch, not afraid of dust, water and dirt influence, suitable for harsh environment. However, capacitance varies with temperature, humidity or environmental electric field, so its stability is poor, low resolution and easy to drift.

Capacitive Screen,Projected Capacitive,Capacitive Touch Panel,Projected Capacitive Touch

Tonya Display Limited , https://www.tydisplay.com