China has gradually become the world's LED packaging device manufacturing center

In recent years, China has gradually become the manufacturing center of LED packaging devices in the world, and the capacity of domestic LED packaging companies has expanded rapidly. In 2015, the total size of local LED packaging companies is expected to exceed 60 billion.

Lighting Division general manager Sen Lin Jiliang <br> <br> fact, in the packaging industry, the demand for diversified industrial chain packaging companies have been unable to rely on monomer meet all orders in the market, as packaging companies, only good market position In order to achieve its own product specialization and low cost.

PHILIPS LUMILEDS Asia Marketing Director Zhou Xuejun <br> <br> next part of the package can not reduce costs is critical to reducing the overall cost of doing business. And the needs of LED customers have always been very complex, these are opportunities for packaging companies.

Qu Junyi , general manager of Liyang Optoelectronics In 2015, the market price of LED lighting fixtures may drop to 1/3 of 2010, when the penetration rate of LED will rise to 50%. It is predicted that by 2020, LED lighting is very likely to occupy More than 75% market share. ”

Jing, general manager of Taiwan shares GONG <br> <br> on the packaging industry, the Mainland of China market is currently the main supplier is still concentrated in low-end products, the market of high-end packaging products less involved. For this reason, China's domestic packaging companies are required to actively develop medium and high-end packaging technologies for market demand, seize business opportunities, and have a clear corporate positioning.

Xiao Guowei <br> <br> crystal Electronics Co., the current president, many famous LED companies are beginning to invest CSP (Chip Scale Package) level packaging development and production process, and the market has a lot of light The finished product appears. At the same time, in the product application side, some lighting companies have begun to try CSP light sources in the field of street lamps and other applications. Everyone is more optimistic about this advanced packaging form, and thinks it will be the future trend.

Grid days photoelectric LED Division General Manager Zheng Xiantao <br> <br> flip chip integrated module is ideal for high-density areas of expertise, such as the stage, automobiles, projectors, special lighting and other special lighting markets such as searchlights. In the future, the realization of downward and outward extension, continuous innovation and change of mode, complementation of strong and strong joint advantages, and transformation from the manufacturing service industry will become a train of higher and farther LED packaging enterprises.

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